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Trump said that he would use aid to Ukraine as a bargaining chip to force Russia to sit at the negotiating table. US President-elect Donald Trump said that he would use US support to Ukraine as a bargaining chip to force Russia to end the conflict through negotiations.The yield of 10-year treasury bonds approached 1.8%. On December 12, the bond market continued its strong market, and the yield of 10-year treasury bonds approached the important mark of 1.8%, and the short-term interest rate bonds appeared to make up the market. Analysts believe that the downside of the current policy interest rate is open, and the market interest rate may accelerate to a balanced low. At the same time, the market is gradually overdrawn, and the institution advises investors to pay attention to the allocation value of local government bonds and rationally arrange the trend investment opportunities at the end of the year and the beginning of the year. (SSE)Onshore RMB against the US dollar (CNY) closed at 7.2700 yuan at 03:00 Beijing time, down 85 points from Wednesday night's close. The turnover was $42.042 billion.

New york Fed: Neil will be a senior consultant until he leaves.Blinken said that the United States is trying to bring back the citizens found in Syria. When meeting in Jordan to discuss the political transition in Syria, US Secretary of State Anthony Blinken said that the United States is trying to bring back an American citizen found in Syria on Thursday.On Thursday (December 12), the won finally fell 0.05% against the US dollar to 1,429.98 won, which was as low as 1,434.70 won at 10:53 Beijing time.

Venezuela: This week, 103 people arrested after the July elections were released.Apple is about to switch to self-developed Bluetooth and Wi-Fi chips for iPhone and smart home. Apple plans to switch to domestic chips for Bluetooth and Wi-Fi connection on its devices from next year, which will gradually phase out some components currently provided by Broadcom. This chip, code-named Proxima, has been developed for several years and is now planned to be used in the first batch of iPhone and smart home devices produced in 2025. The internal chips of iPhone manufacturers will be produced by TSMC.2 trillion yuan of special refinancing bonds will be issued next week. According to China Bond Information Network, Beijing plans to issue the eleventh batch of government bonds in Beijing in 2024 by tender on December 18th. By then, the task of issuing 2 trillion yuan of local government refinancing special bonds to "replace the hidden debts in stock" will be completed during the year. At present, 29 provinces have disclosed the issuance arrangement of special refinancing special bonds, while Guangdong Province and Shanghai did not participate in this round of hidden debt swap. (Securities Times)